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Impact of Strain-Induced Wafer-Bow on the Manufacture of VCSELs Grown on 150mm GaAs and Ge substrates (2022)

First Author: Baker J.

Attributed to: Future Compound Semiconductor Manufacturing Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Type: Other

Parent Publication: 2022 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2022