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Microstructural and mechanical integrity of Cu/Cu joints formed through transient liquid bonding with Cu-Sn nanocomposite interlayer (2022)

First Author: Jiang H

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/eptc56328.2022.10013299

Publication URI: http://dx.doi.org/10.1109/eptc56328.2022.10013299

Type: Conference/Paper/Proceeding/Abstract