Low Temperature Fluxless Cu Bonding with Cu Micropillar Array (2022)

First Author: Jiang H

Attributed to: Underpinning Multi-User Equipment funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/icsj55786.2022.10034701

Publication URI: http://dx.doi.org/10.1109/icsj55786.2022.10034701

Type: Conference/Paper/Proceeding/Abstract