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Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging (2022)

First Author: Liu C

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/eptc56328.2022.10013226

Publication URI: http://dx.doi.org/10.1109/eptc56328.2022.10013226

Type: Conference/Paper/Proceeding/Abstract