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Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging (2022)

First Author: Liu C

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/icsj55786.2022.10034730

Publication URI: http://dx.doi.org/10.1109/icsj55786.2022.10034730

Type: Conference/Paper/Proceeding/Abstract