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Molecular Dynamics Simulations of the Thermal Evolution of Voids in Cu Bulk and Grain Boundaries

First Author: Fotopoulos V

Attributed to: Structural dynamics of amorphous functional oxides - the role of morphology and electrical stress funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/978-3-031-22524-6_93

Publication URI: http://dx.doi.org/10.1007/978-3-031-22524-6_93

Type: Book Chapter

Book Title: TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings (2023)

Page Reference: 1001-1010

ISSN: 23671696 23671181