Low Temperature Fluxless Cu Bonding with Cu Micropillar Array (2022)

First Author: Jiang H
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/icsj55786.2022.10034701

Publication URI: http://dx.doi.org/10.1109/icsj55786.2022.10034701

Type: Conference/Paper/Proceeding/Abstract