Achieving Low Thermal Stress in a PCB/AMB Hybrid SiC Power Module Using Fluidic Connections Based on Liquid Metal (2023)

First Author: Mu W

Attributed to: Sir Henry Royce Institute - Cambridge Equipment funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ecce53617.2023.10362396

Publication URI: http://dx.doi.org/10.1109/ecce53617.2023.10362396

Type: Conference/Paper/Proceeding/Abstract