A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints (2022)
Attributed to:
High reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2204.05583
Publication URI: https://arxiv.org/abs/2204.05583
Type: Other