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The influence of alloying on slip intermittency and the implications for dwell fatigue in titanium (2022)

First Author: Worsnop F

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2203.14615

Publication URI: https://arxiv.org/abs/2203.14615

Type: Other