Accessing slip activity in high purity tin with electron backscatter diffraction and measurement of slip strength (2021)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2104.02681
Publication URI: https://arxiv.org/abs/2104.02681
Type: Preprint