📣 Help Shape the Future of UKRI's Gateway to Research (GtR)

We're improving UKRI's Gateway to Research and are seeking your input! Tell us what works, what doesn't, and how we can make GtR more user-friendly, impactful, and effective for the Research and Innovation community. Please send your feedback to gateway@ukri.org by 11 August 2025.

The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures (2020)

First Author: Gu T

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2007.08266

Publication URI: https://arxiv.org/abs/2007.08266

Type: Other