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In-situ study of creep in Sn-3Ag-0.5Cu solder (2020)

First Author: Gu T

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2006.05904

Publication URI: https://arxiv.org/abs/2006.05904

Type: Preprint