In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint (2019)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.1908.00401
Publication URI: https://arxiv.org/abs/1908.00401
Type: Preprint