Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module (2024)

First Author: Rajaguru P
Attributed to:  Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/access.2023.3342689

Publication URI: http://dx.doi.org/10.1109/access.2023.3342689

Type: Journal Article/Review

Parent Publication: IEEE Access