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Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints (2024)

First Author: Xu Y

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmps.2024.105623

Publication URI: http://dx.doi.org/10.1016/j.jmps.2024.105623

Type: Journal Article/Review

Parent Publication: Journal of the Mechanics and Physics of Solids