Band Offset Models of Three-Dimensionally Bonded Semiconductors and Insulators (2019)

First Author: Guo Y
Attributed to:  Integration of Novel Materials in Spintronic Devices funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.17863/cam.37351

Publication URI: https://www.repository.cam.ac.uk/handle/1810/290126

Type: Journal Article/Review