Molecular simulation of thermoset curing: application to 3D printing materials (2021)

First Author: Jenei M

Attributed to: Topological Evolution of Polymer Networks funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.17863/cam.59116

Publication URI: https://www.repository.cam.ac.uk/handle/1810/312020

Type: Journal Article/Review