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Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling (2024)

First Author: Agyakwa P

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-023-10870-4

Publication URI: http://dx.doi.org/10.1007/s11664-023-10870-4

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 3