Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction (2024)
Abstract
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Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.pedc.2024.100063
Publication URI: http://dx.doi.org/10.1016/j.pedc.2024.100063
Type: Journal Article/Review
Parent Publication: Power Electronic Devices and Components