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Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction (2024)

First Author: Hassan S

Attributed to: Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.pedc.2024.100063

Publication URI: http://dx.doi.org/10.1016/j.pedc.2024.100063

Type: Journal Article/Review

Parent Publication: Power Electronic Devices and Components