Passivating Polycrystalline Copper with an Ultrathin Samarium Layer (2024)

First Author: Abrahamczyk S

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/adem.202301052

Publication URI: http://dx.doi.org/10.1002/adem.202301052

Type: Journal Article/Review

Parent Publication: Advanced Engineering Materials

Issue: 3