Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding (2024)

First Author: Chen Y
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2024.108401

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2024.108401

Type: Journal Article/Review

Parent Publication: Materials Today Communications