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Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding (2024)

First Author: Chen Y

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2024.108401

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2024.108401

Type: Journal Article/Review

Parent Publication: Materials Today Communications