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The role of microstructure in the thermal fatigue of solder joints. (2024)

First Author: Xian JW

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1038/s41467-024-48532-6

PubMed Identifier: 38769155

Publication URI: http://europepmc.org/abstract/MED/38769155

Type: Journal Article/Review

Volume: 15

Parent Publication: Nature communications

Issue: 1

ISSN: 2041-1723