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Fatigue prediction through quantification of critical defects and crack growth behaviour in additively manufactured Ti-6Al-4V alloy (2024)

First Author: Naab B

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.msea.2024.146658

Publication URI: http://dx.doi.org/10.1016/j.msea.2024.146658

Type: Journal Article/Review

Parent Publication: Materials Science and Engineering: A