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Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification (2024)

First Author: Sun S

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-024-11447-5

Publication URI: http://dx.doi.org/10.1007/s11664-024-11447-5

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 12