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Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders (2024)

First Author: Gu T

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.msea.2024.147429

Publication URI: http://dx.doi.org/10.1016/j.msea.2024.147429

Type: Journal Article/Review

Parent Publication: Materials Science and Engineering: A