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Out-of-plane heat transfer in van der Waals stacks: electron-hyperbolic phonon coupling (2017)

First Author: Tielrooij K

Attributed to: Engineering van der Waals heterostructures: from atomic level layer-by-layer assembly to printable innovative devices funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.1702.03766

Publication URI: https://arxiv.org/abs/1702.03766

Type: Other