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Plasma Processes for Vertical Niobium Nitride Superconducting Through Silicon Vias (2025)

First Author: Ren Z

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/led.2024.3522184

Publication URI: http://dx.doi.org/10.1109/led.2024.3522184

Type: Journal Article/Review

Parent Publication: IEEE Electron Device Letters

Issue: 2