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Bias and Temperature Stress Effects in IGZO TFTs and the Application of Step-Stress Testing to Increase Reliability Test Throughput (2024)

First Author: Mohammadian N

Attributed to: Green Energy-Optimised Printed ICs funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ted.2024.3462693

Publication URI: http://dx.doi.org/10.1109/ted.2024.3462693

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Electron Devices

Issue: 11