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Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications (2019)

First Author: Liu G

Attributed to: Novel GaN Power Devices and Packaging Technologies for 300C Ambient Operation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4071/2380-4491.2019.hiten.000052

Publication URI: http://dx.doi.org/10.4071/2380-4491.2019.hiten.000052

Type: Journal Article/Review

Parent Publication: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

Issue: HiTen

ISSN: 22228748