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Inverse Order Packaging (invPack): Power Module Packaging Technique using Standard Fabrication Processes and Achieving Improved Performance at Lower Cost (2024)

First Author: Almpanis I

Attributed to: Multi-Domain Virtual Prototyping Techniques for Wide-Bandgap Power Electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/dmc62632.2024.10812160

Publication URI: http://dx.doi.org/10.1109/dmc62632.2024.10812160

Type: Conference/Paper/Proceeding/Abstract