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Solidification microstructure variations in additively manufactured Ti-6Al-4V using laser powder bed fusion (2023)

First Author: Yang L

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.scriptamat.2023.115430

Publication URI: http://dx.doi.org/10.1016/j.scriptamat.2023.115430

Type: Journal Article/Review

Parent Publication: Scripta Materialia

ISSN: 13596462