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Evaluation of the Environmental Impact within Semiconductor Packaging Materials (2024)

First Author: Kettle J

Attributed to: Green Energy-Optimised Printed ICs funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4071/001c.94747

Publication URI: http://dx.doi.org/10.4071/001c.94747

Type: Journal Article/Review

Parent Publication: IMAPSource Proceedings

Issue: EMPC

ISSN: 22228748