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Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction (2023)

First Author: Liu C

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4071/001c.89937

Publication URI: http://dx.doi.org/10.4071/001c.89937

Type: Journal Article/Review

Parent Publication: IMAPSource Proceedings

Issue: HiTEN

ISSN: 22228748