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Physics-informed Machine Learning for Predicting Fatigue Damage of Wire Bonds in Power Electronic Modules (2024)

First Author: Stoyanov S

Attributed to: Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/eurosime60745.2024.10491522

Publication URI: http://dx.doi.org/10.1109/eurosime60745.2024.10491522

Type: Conference/Paper/Proceeding/Abstract