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Chip-Scale 3D Quilt Packaging for Modular Neural Implants (2025)

First Author: Bernardoni C

Attributed to: Bionanofabrication Suite funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.23919/empc63132.2025.11222409

Publication URI: http://dx.doi.org/10.23919/empc63132.2025.11222409

Type: Conference/Paper/Proceeding/Abstract