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Hybrid copper-silver nanoparticle inks and their performance under thermal and photonic sintering (2026)

First Author: Pervan D

Attributed to: Future Additive Manufacturing Platform Grant funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1039/d5tc03927d

Publication URI: http://dx.doi.org/10.1039/d5tc03927d

Type: Journal Article/Review

Parent Publication: Journal of Materials Chemistry C

Issue: 14