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Megasonic agitation for enhanced electrodeposition of copper (2009)

First Author: Kaufmann J

Attributed to: Scottish Manufacturing Institute - Renewal, 2008 - 2013 funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s00542-009-0886-2

Publication URI: http://dx.doi.org/10.1007/s00542-009-0886-2

Type: Journal Article/Review

Parent Publication: Microsystem Technologies

Issue: 8