Megasonic agitation for enhanced electrodeposition of copper (2009)
Attributed to:
Scottish Manufacturing Institute - Renewal, 2008 - 2013
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s00542-009-0886-2
Publication URI: http://dx.doi.org/10.1007/s00542-009-0886-2
Type: Journal Article/Review
Parent Publication: Microsystem Technologies
Issue: 8