A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes (2010)
Attributed to:
Technologies for SiC electronics and sensors in extreme environments
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s10853-009-4199-8
Publication URI: http://dx.doi.org/10.1007/s10853-009-4199-8
Type: Journal Article/Review
Parent Publication: Journal of Materials Science
Issue: 9