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Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates (2012)

First Author: Kotadia H

Attributed to: Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2011.09.024

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2011.09.024

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds

Issue: 1