Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates (2012)
Attributed to:
Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2011.09.024
Publication URI: http://dx.doi.org/10.1016/j.jallcom.2011.09.024
Type: Journal Article/Review
Parent Publication: Journal of Alloys and Compounds
Issue: 1