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Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating (2011)

First Author: Lorenz N

Attributed to: Scottish Manufacturing Institute - Renewal, 2008 - 2013 funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2011.04.010

Publication URI: http://dx.doi.org/10.1016/j.microrel.2011.04.010

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 12