Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating (2011)
Attributed to:
Scottish Manufacturing Institute - Renewal, 2008 - 2013
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2011.04.010
Publication URI: http://dx.doi.org/10.1016/j.microrel.2011.04.010
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
Issue: 12