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Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction (2012)

First Author: Kotadia H

Attributed to: Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/1.3699359

Publication URI: http://dx.doi.org/10.1063/1.3699359

Type: Journal Article/Review

Parent Publication: Journal of Applied Physics

Issue: 7