Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction (2012)
Attributed to:
Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1063/1.3699359
Publication URI: http://dx.doi.org/10.1063/1.3699359
Type: Journal Article/Review
Parent Publication: Journal of Applied Physics
Issue: 7