A direct-writing approach to the micro-patterning of copper onto polyimide (2009)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1108/03056120910953268
Publication URI: http://dx.doi.org/10.1108/03056120910953268
Type: Journal Article/Review
Parent Publication: Circuit World
Issue: 2