Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging (2009)
Attributed to:
Scottish Manufacturing Institute - Renewal, 2008 - 2013
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1108/09540910910928265
Publication URI: http://dx.doi.org/10.1108/09540910910928265
Type: Journal Article/Review
Parent Publication: Soldering & Surface Mount Technology
Issue: 1