A review of stencil printing for microelectronic packaging (2012)

First Author: Kay R
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1108/09540911211198540

Publication URI: http://dx.doi.org/10.1108/09540911211198540

Type: Journal Article/Review

Parent Publication: Soldering & Surface Mount Technology

Issue: 1