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Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects (2012)

First Author: Xu S

Attributed to: Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ectc.2012.6249097

Publication URI: http://dx.doi.org/10.1109/ectc.2012.6249097

Type: Conference/Paper/Proceeding/Abstract

ISBN: 978-1-4673-1966-9