Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects (2012)
Attributed to:
Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/ectc.2012.6249097
Publication URI: http://dx.doi.org/10.1109/ectc.2012.6249097
Type: Conference/Paper/Proceeding/Abstract
ISBN: 978-1-4673-1966-9